Lugar de origen: | Shangai |
Nombre de la marca: | SIGNI |
Detalles de empaquetado: | Cartón |
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Condiciones de pago: | T/T, L/C, PAYPAL, UNIÓN DEL OESTE |
Color: | según la petición de los clientes | Embalaje: | Botella plástica |
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Tamaño: | Según el pedido de los clientes | ||
Alta luz: | 50nm Diamond Polishing Paste,50g Diamond Polishing Paste,50nm diamond cutting paste |
Diamond paste for precise polishing of stainless steel workpiece
Characteristics:
★ Unique loose structure of spherical crystalline of nano diamond.
★ Superfine dispersing effects because of unique ultra-dispersing technique.
★ Angstrom-level accuracy surface finish.
Available Sizes:
Size(nm) | 50 | 80 | 100 | 150 | 200 | 300 | 400 | 500 |
Media | Water / oil | Water / oil | Water / oil | Water / oil | Water / oil | Water / oil | Water / oil | Water / oil |
Remarks: Special sizes can be tailor-made.
Application:
1, Semiconductor wafer polishing: monocrystalline silicon wafer, polycrystalline silicon wafer, sapphire wafer, SiC wafer, etc..
2, Magnetic recording materials polishing: computer hard disk substrate, computer hard disk head.
Diamond Paste For Polishing
Our diamond paste are made with diamond particles completely dispersed in the mixed liquids. 3 series according to the constituents:
Monocrystaline Diamond Slurry(MDL):Good removal effects, suitable for lapping & polishing of hard material.
PolycrystalineDiamond Slurry(PDL): Superb tenacity & self-sharpening features. Suitable for lapping and polishing of precision metal material, optical crystals, ceramics and hard materials.
Nano Diamond Slurry(NDL): Good dispersing stability & suitable for precise surface treatment.
ultra-dispersing effect Nano diamond slurry(NDS) lapping and precision polishing
1.Widely used for lapping and precise polishing. |
2.Fine chemical-mechanical performance. |
3.Water or oil basis |
Our diamond paste are made with diamond particles completely dispersed in the mixed liquids. They have fine chemical-mechanical performance and are widely used for lapping and precision polishing of wafer substrates, compound crystals, optical devices, LCD, gems, metallic works, etc.
CLASSIFICATIONS & MAIN APPLICATION FIELD
PDS Polycrystaline Diamond
Persona de Contacto: Zhao
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